Product Detail
LN-1003 Fanless BOX-PC
Fanless industrial BOX-PC powered by Intel 11th generation Tiger Lake-U processors, designed for industrial networking, automation, edge gateway and IoT applications.
Engineering Data
Full Specification Table
This table is the single authoritative area for complete product parameters.
| Processor | Onboard Intel 11th generation Tiger Lake-U series processor |
|---|---|
| Chipset | Intel |
| Memory | 2 x DDR4 3200MHz SO-DIMM, up to 64GB |
| Storage | 1 x M.2 Key-M 2280 NVMe PCIe3.0 x4 / SATA3.0 + 1 x SATA3.0 |
| LAN | 6 x Intel 2.5G LAN ports |
| COM | 1 x COM, RJ45 interface |
| USB | 4 x USB3.0 + 2 x USB2.0 |
| Display Output | 1 x HDMI2.0, up to 4096 x 2160 @ 60Hz |
| Expansion | 1 x MiniPCIe slot, supports PCIe and USB2.0; WiFi / 3G / 4G; 1 x 8-bit GPIO |
| Power Input | DC12V-19V input, 90W |
| Operating Temperature | -10°C to 60°C |
| Storage Temperature | -40°C to 80°C |
| Humidity | 10% - 95% @ 40°C, non-condensing |
| Dimensions | 182 x 125 x 62.5mm |
| Material | High-efficiency heat dissipation aluminum alloy |
| Thermal Design | Fanless passive heat dissipation |
| Mounting | Embedded / Wall Mount / Desktop Bracket |
| Weight | Net 1.5kg / Gross 2.0kg |
| Operating System | Windows 10 / Windows 11 / Linux |
I/O Visual Layout
Connector position overview
Use this visual map to identify connector areas. Detailed electrical and port specifications are kept only in the Full Specification Table.
LAN
Ethernet / network port area
COM
Serial DB9 communication area
USB
USB peripheral connection area
Display
Monitor output position
Power
DC input position
Expansion
Module or expansion slot area
Configuration Options
Project-selectable options
Use Case Fit
Applications this product can support
OEM / ODM Support
Customization support capabilities
Documentation
Documentation / Datasheet
ln-1003.pdf
PDF / 368 KB / Available for engineering review
Quality & Compliance
Quality & Compliance for Industrial Projects
Project buyers can discuss compliance documents, aging test requirements, thermal design, lifecycle supply and sample validation before RFQ.
CE / FCC / RoHS documentation support100% aging test discussion for batch ordersWide temperature and vibration reviewFanless thermal design validationLong lifecycle supply supportOEM / ODM engineering communication
Product RFQ
Request configuration review for LN-1003.
Send the application, quantity, required I/O, mounting method, power input and OS support so engineering can confirm a practical quotation path.
Engineering review
Datasheet follow-up
OEM / ODM options